| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that moisture absorption reliability cannot be sufficiently obtained owing to coherency with a semiconductor device when semiconductor packaging is carried out by using a thermosetting resin, and to provide the manufacturing method of a semiconductor device that can improve the coherency between the thermosetting resin and the semiconductor device, and the reliability of the semiconductor device. SOLUTION: During the crimping of a semiconductor device 2, a substrate 4 is cooled, thus suppressing heat transfer to the substrate 4 when a thermosetting resin 1 is to be heated, reducing strain since the thermal expansion of the substrate 4 approaches that of the semiconductor element 2, eliminating the crack between the semiconductor device 2 and thermosetting resin 1 or the substrate 4 and thermosetting resin 1, and hence improving the moisture absorption reliability of the semiconductor device.</p> |
