发明名称 HEAT TREATMENT APPARATUS FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To suppress the deformation of a heat plate due to heat contraction of a supporting member. SOLUTION: A heat plate 65 in a post exposure baking device is supported by an annular supporting member 70 having a circular step 70a along the inner circumference thereof. The supporting member 70 is fixed on a support 74 with a plurality of bolts 71. The bolts 71 are provided on the inner circumferential surface of the step 70a facing the outer circumferential surface of the heat plate 65, in a manner that the circumferential surface on the side of the heat plate 65 of the bolts 71 may be exposed toward the side of the heat plate 65. In addition, a collar 76 is provided around the outer circumference of the bolt 71, and the heat plate 65 is fixed at a given position by the collar 76.
申请公布号 JP2001257144(A) 申请公布日期 2001.09.21
申请号 JP20000064885 申请日期 2000.03.09
申请人 TOKYO ELECTRON LTD 发明人 KUGA TAKAHIRO;TAGAMI MITSUHIRO;TANAKA KOICHIRO
分类号 G03F7/30;H01L21/00;H01L21/02;H01L21/027;H01L21/687;(IPC1-7):H01L21/027 主分类号 G03F7/30
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