| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cost-reduced hybrid IC device and a method of manufacturing the same. SOLUTION: In a package 2 of the hybrid IC device 1, a circuit board 3 is disposed. The circuit board 3 is mounted with a plurality of electronic components, including a power element 12. On an upper face of the circuit board 3, the power element 12, flip chip IC 13, or the like are bonded by solder 16, 18. On a lower face of the circuit board 3, a chip capacitor 15 or the like are bonded by a conductive adhesive 19. The chip capacitor 15, formed on the lower face of the circuit board 3, is housed in a recessed part 4a of a metal case 4, which constitutes the package 2, The circuit board 3 and the metal case 4 are bonded together via an adhesive 23 having high thermal conductivity.</p> |
