发明名称 |
PRINTED CIRCUIT BOARD MANUFACTURE |
摘要 |
A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
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申请公布号 |
US2001022989(A1) |
申请公布日期 |
2001.09.20 |
申请号 |
US19970939656 |
申请日期 |
1997.09.29 |
申请人 |
SOUTAR ANDREW M.;MCGRATH PETER T. |
发明人 |
SOUTAR ANDREW M.;MCGRATH PETER T. |
分类号 |
C23C18/31;C23C18/32;C23C18/42;H05K3/24;H05K3/42;(IPC1-7):B05D3/10;B05D1/38 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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