| 摘要 |
A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.
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