发明名称 FILM CUTTING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film cutting device, and a film cutting method capable of correctly cutting a film while preventing position slippage of the film when it is cut. SOLUTION: A film 3 is fixed by tightly applying a cutting ruler 14, a first clasp 15, and a second clasp 16 to the film 3, and a cutter 7 is run to cut the film 3 in this film cutting device 13. In this constitution, the film 3 can be securely fixed, and position slippage of the film 3 can be prevented when it is cut, thereby the film 3 can be correctly cut.
申请公布号 JP2001252891(A) 申请公布日期 2001.09.18
申请号 JP20000066792 申请日期 2000.03.10
申请人 MEIKI CO LTD 发明人 NISHINO GOSHUN
分类号 B26D1/18;(IPC1-7):B26D1/18 主分类号 B26D1/18
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