发明名称 GRINDING PARTICLE FOR POLISHING AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide grinding particles for polishing capable of providing good surface roughness in polishing a polished board, and of stably polishing it while improving a polishing speed and to provide their manufacturing method. SOLUTION: Ultra-fine particles 11, 14 each having a particle diameter of 1 to 100 nm are fixed on the surface of a grinding particle 13 having a particle diameter of 0.1 to severalμm.</p>
申请公布号 JP2001252860(A) 申请公布日期 2001.09.18
申请号 JP20000062587 申请日期 2000.03.07
申请人 EBARA CORP 发明人 WADA TAKETAKA
分类号 B24B37/00;B82Y10/00;B82Y99/00;C09K3/14;H01L21/304;(IPC1-7):B24B37/00 主分类号 B24B37/00
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