发明名称 MOUNTING STRUCTURE FOR A SEMICONDUCTOR CIRCUIT
摘要 In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output.
申请公布号 CA2202426(C) 申请公布日期 2001.09.18
申请号 CA19972202426 申请日期 1997.04.11
申请人 NEC CORPORATION 发明人 MIYOSHI, TADAYOSHI
分类号 H01L21/60;H01L23/495;H01L25/04;H01L25/16;H01L25/18;H05K1/14;H05K1/18;H05K3/00 主分类号 H01L21/60
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