发明名称 MOLDING DIES FOR TILE
摘要 PROBLEM TO BE SOLVED: To mold a tile of which the deformation due to a burning shrinkage is less. SOLUTION: Attaching grooves 14, 14a and so forth are indented on a lower die 5, and at the same time, soft materials 15, 15a and so forth of a specified thickness are housed. Then, on the front and rear surfaces of an elastic body 12 which is bonded to the lower die 5, protruding sections 13, 13a and so forth and fitting protrusions 16, 16a and so forth are integrally protrusion-formed respectively. By fitting the fitting protrusions 16, 16a and so forth in the attaching grooves 14, 14a and so forth in which the soft materials 15, 15a and so forth are housed, the soft materials 15, 15a and so forth deform at the time of a compression-molding, and a tile of a uniform density is molded. Because of the simple structure, this method can be applied to a small die as well.
申请公布号 JP2001252915(A) 申请公布日期 2001.09.18
申请号 JP20000066223 申请日期 2000.03.10
申请人 NIPPON CHOKO KK 发明人 MIYAMA TAKATOSHI;KITAGAWA FUMINORI;NAGAMORI HIROHITO
分类号 B28B7/00;B28B3/02;B28B7/34;(IPC1-7):B28B7/00 主分类号 B28B7/00
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