| 摘要 |
The disclosure is for a heat sink or heat pipe wall structure (34) which minimizes the thermal resistance at the thermal interface with another device. The structure is constructed as a matrix of material with encased heat conductive fibers (12 and 24) which are oriented in the direction of heat flow. The preferred embodiment incorporates carbon fibers (12, 24 and 30) extending through the body (18) and out of at least one surface of the heat sink. Copper is cast around the fibers, and the fibers protrude from the metal at the surface (14, 16, 26 and 28) in thermal contact with another device. In a heat sink, fibers extending out another surface of the structure can serve as fluid cooled spines, and the fibers can also protrude through the other side of a heat pipe wall to serve as a capillary wick (30). |
