| 摘要 |
<p>PURPOSE: To resin-seal a substrate mounted with a flip-chip system of a semiconductor chip in a short time to manufacture an electronic component. CONSTITUTION: A resin sealing device is provided with a movable bottom mold 25 which is placed with a substrate 1, an elevating mechanism 30 to vertically move the mold 25, a carrying-out mechanism 31 to move the mold 25 in the horizontal direction in a state that the substrate 1 or a completed electronic component is placed on the mold 25, an intermediate mold 8C which is abutted on the peripheral edge part of the substrate 1 in a state that the mold 25 is ascended, a resin film 10 which is stretched on the mold 8C and the substrate 1, a film stretching mechanism 29 to feed and stretch the film 10, a metal mold 18 for a semiconductor chip to press the back surface of the semiconductor chip 2 via the film 10, and a top mold 6 to press the upper surface of the mold 8C via the film 10.</p> |
