MANUFACTURING METHOD OF CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem where a printed substrate, a ceramic substrate, a flexible sheet or the like is used as a support substrate and the thickness of a support substrate, essentially unnecessary for a circuit device, enlarges the size of the circuit device. SOLUTION: After a separation groove 54 is formed in a first conductive foil 60A, a circuit element is packaged and insulation resin 50 is applied by using the laminated conductive foil 60 as a support substrate and reversed. Thereafter, a second conductive foil 60B is etched and separated as a conductive path by using the insulation resin 50 as a support substrate. Therefore, a circuit device where a conductive path 51 and a circuit element 52 are supported by the insulation resin 50 can be realized without adopting a support substrate. Furthermore, drop-out of a wiring which becomes absolutely necessary for a circuit can be prevented.