| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite material which provides required heat conduc tivity when used as a heat-radiation member of a semiconductor device or an electronic part mounting base material, and at least provides a lower thermal expansion coefficient on the side facing the semiconductor device, while manufac tured at a low cost. SOLUTION: Related to a composite material 1, a carbon fiber 3 is embedded on one surface of a square metal plate member 2. As the metal 2, a copper of high heat conductivity is used. The carbon fiber 3 comprises a fabric (plain woven fabric) 4 where fibers are arrayed in two directions orthogonal to each other, which is embedded so that a part of the fabric 4 is exposed on the surface of the metal 2 while the array of the carbon fiber 3 runs in X, Y direction of the composite material. A PAN carbon fiber is used for the carbon fiber 3. The amount of the carbon fiber 3 is set to 30-50% in volume ratio at a part where the carbon fiber 3 is embedded.
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