| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method by which no down-set is needed, the manufacturing yield of the lead frame is hardly reduced, and the difficulty of positioning the semiconductor element due to produced viscosity just when an adhesive layer is formed can be eliminated. SOLUTION: A die pad 3 of a lead frame to which a semiconductor element is mounted is flat. It is made larger in size than a second semiconductor element 2 to be mounted to the die pad 3 and is made smaller in size than a first semiconductor element 1 to be mounted beneath the die pad 3. Then the rear surface of the semiconductor element 2 is fixed to the die pad 3 by means of a second adhesive layer 5, and the front surface of the semiconductor element 1 is fixed to the underside of the die pad 3 by means of a first adhesive layer 4. In this case, the adhesive layers on/under the die pad 3 are displaced in position and arranged. |
