SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To simplify the process, reduce the cost and meet the demand for multiple pin structures in a semiconductor device with a semiconductor element mounted in a package such as BGA. SOLUTION: The semiconductor device 10 comprises a wiring substrate 11 having a resin layer 12 with a wiring pattern 13 formed on one surface for connecting outer connection terminals 19, and a semiconductor element 14 having projecting electrode terminals 16. The semiconductor element 14 is bonded to the other surface of the resin layer 12 through an adhesive layer 17 and the projecting electrode terminals 16 connected to the wiring pattern 13 after piercing the adhesive layer 17 and the resin layer 12.