| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element which can be connected to a wiring board with inexpensive Sn-Pb solder. SOLUTION: The light emitting element 50 has a (p) type semiconductor 12, an (n) type semiconductor 11 which is joined with the (p) type semiconductor, a positive electrode 51 which is formed on the (p) type semiconductor, and a negative electrode 52 which is formed on the (n) type semiconductor; and the negative electrode 52 and positive electrode 51 are formed of ohmic contact layers 13 and 14 on the (n) type semiconductor 11 or (p) type semiconductor 12, plating layers 15 and 16 formed of Ni thereupon to a thickness of 1000 to 3000 nm and plating layers 17 and 18 formed of Au or Au alloy thereupon to a thickness of 40 to 300 nm. |
