发明名称 INSULATING MATERIAL FOR MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide insulating material for a multilayer printed wiring board wherein clear, uniform and fine anchors can be formed and insulating resin having spreadability is main component. SOLUTION: In the insulating material, hardened substance fine powder wherein thermosetting resin which can be roughened to acid or oxidizing agent and silica filler are uniformly dispersed and then hardened is dispersed in matrix which is hard to dissolve in the acid or oxidizing agent. It is preferable that polyether sulfone is used as the matrix.
申请公布号 JP2001251059(A) 申请公布日期 2001.09.14
申请号 JP20000058700 申请日期 2000.03.03
申请人 TOPPAN PRINTING CO LTD 发明人 YAMAGATA SHINICHIRO;KAWAMOTO KENJI
分类号 C08K3/36;C08L63/00;C08L81/06;C08L101/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 C08K3/36
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