CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To stabilize connection resistance for a long time. SOLUTION: Protective agent 6 for protecting a wiring 1 is dispersively arranged in spots on an interface between a via 3 and a wiring layer 2. Each size of interface regions 7 on which the protective agent 6 does not exist is set as the size wherein a plurality of conducting powders 4 constituting the via 3 can abut against the wiring layer 2. Thereby the plurality of conducting powders 4 are made to abut against the wiring layer 2 on the respective interface regions 7 on which the protective agent 6 does not exist, and they are electrically connected.