发明名称 BONDER CHUCK AND OPTICAL COMPONENT MOUNTING STRUCTURE
摘要 <p>An optical component is adapted for pick-and-place-style installation on an optical submount (100) or bench and compatible with a chuck of a bonder (200) that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element (104), such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface (152) that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface (154) to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.</p>
申请公布号 WO2001067149(A2) 申请公布日期 2001.09.13
申请号 US2001006927 申请日期 2001.03.01
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