Power module has insulating substrate with semiconducting power component, control substrate with control IC for controlling power component, conducting bearer plate and housing

摘要

The module has an insulating substrate (5) with a main surface to which a semiconducting power component (7) is applied, a control substrate (11) on which a control IC (13) for controlling the power component is mounted, a conducting bearer plate (2) to which the insulating and control substrates are attached and a conductive housing (1) attached to the periphery of the bearer plate to enclose the substrates and the bearer plate.