| 摘要 |
<p>A backlight device comprises a light-guide plate, a fluorescent lamp having terminals on both ends and placed along one side of the light-guide plate, a reflector provided on one main surface of the light-guide plate, and a reflector film provided on the light-guide plate to cover the fluorescent lamp. The terminals of the fluorescent lamp are soldered with leads and heat sinks. Since the heat sinks keep the temperature of the soldered parts from rising, the soldered parts are prevented from deterioration, thereby preventing failures of contact between the lamp terminals and the leads.</p> |
