发明名称 |
System and method for detecting CMP endpoint via direct chemical monitoring of reactions |
摘要 |
A system and method for detecting process endpoint in CMP is presented which monitors the progression of chemical activities that take place from the chemical reaction that occurs at the wafer surface during polishing. In order to monitor the progression of chemical activities taking place from the chemical reaction, a surface plasmon resonance sensor acts as a conducting surface which supports surface plasmon resonance.
|
申请公布号 |
US6287171(B1) |
申请公布日期 |
2001.09.11 |
申请号 |
US20000504565 |
申请日期 |
2000.02.15 |
申请人 |
SPEEDFAM-IPEC CORPORATION |
发明人 |
MELONI MARK |
分类号 |
B24B37/04;B24B49/12;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|