发明名称 STRUCTURAL BODY, ESPECIALLY AN INFRARED SENSOR AND A METHOD FOR PRODUCING A MICROSTRUCTURE FROM A FUNCTIONAL MATERIAL
摘要 The invention relates to a structural body, especially an infrared sensor (5), comprising a carrier body (12) and a structuring layer (11) that is at least partially connected to said carrier body (12) and is at least partially provided with at least one micro component (17) and is partially provided with at least one recess (19) which is at least essentially filled with a hardened functional material (10), especially an infrared absorbing material, which is liquid when filled in. The invention also relates to a method for producing a microstructure (18) from the functional material (10). A recess (19) is structured in a structuring layer (11) in the area of the surface of the structuring layer. Said recess at least approximately forms a negative structure of the microstructure (18) to be produced. The produced recess (19) is at least essentially filled with an, initially liquid, functional material (10). Said method is particularly suitable for producing the inventive structural body or infrared sensor (5) and as a mechanical protection for sensitive micro components (17).
申请公布号 WO0165222(A1) 申请公布日期 2001.09.07
申请号 WO2001DE00539 申请日期 2001.02.13
申请人 ROBERT BOSCH GMBH;BECKER, VOLKER;PANNEK, THORSTEN 发明人 BECKER, VOLKER;PANNEK, THORSTEN
分类号 G01J5/12 主分类号 G01J5/12
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