| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a contactless data carrier whose internal IC chip, circuit board, and antenna coil are not exposed to high temperature and high pressure when a non-contact data carrier is molded. SOLUTION: An electronic circuit module, composed of a circuit board 7 on which an IC chip 6 is mounted and an antenna coil 8 which is connected to the circuit board 7 and which sends and receives information as a radio wave, is inserted into a thin and long groove provided to a resin case 9 from a slit and housed in a resin case. Then low-temperature setting resin 11 which sets at 60 deg.C is injected into the slit 10 from a nozzle 18 to fill the gap in the resin case 9 with the low-temperature thermosetting resin 11, and the resin case is heated at 60 deg.C and sealed. |
