发明名称 PRESSURE-SENSITIVE ADHESIVE SHEET AND COVERED STRUCTURE
摘要 A pressure-sensitive adhesive sheet and a covered structure which are less apt to adversely influence hard-disk devices and the like. The covered structure is constituted of a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer and a pressure-sensitive adhesive sheet substrate and a release sheet comprising a release agent layer and a release sheet substrate, the adhesive sheet being covered with the release sheet so that the release agent layer is in contact with the pressure-sensitive adhesive layer. In the covered structure, the pressure-sensitive adhesive sheet has a silicone content of 500 mu g/m<2> or lower. The total amount of NOx<->, Cl<->, PO4<3->, F<->, K<+>, Na<+>, and Ca<2+> contained in the pressure-sensitive adhesive sheet is preferably 20 mg/m<2> or smaller. The pressure-sensitive adhesive sheet, when heated at 85 DEG C for 30 minutes, preferably has a gas generation amount of 20 mg/m<2> or smaller.
申请公布号 WO0164806(A1) 申请公布日期 2001.09.07
申请号 WO2001JP01683 申请日期 2001.03.05
申请人 LINTEC CORPORATION;SAKURAI, ISAO;OHRUI, TOMOO;KOIKE, HIROSHI;MARUOKA, SHIGENOBU;SHIBANO, TOMISHI 发明人 SAKURAI, ISAO;OHRUI, TOMOO;KOIKE, HIROSHI;MARUOKA, SHIGENOBU;SHIBANO, TOMISHI
分类号 C09J7/02;(IPC1-7):C09J7/02 主分类号 C09J7/02
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