VACUUM VALVE

摘要

PROBLEM TO BE SOLVED: To provide a vacuum valve having stable temperature rise characteristics for further improving the breaking current characteristics of the vacuum valve. SOLUTION: A contact portion of the vacuum valve is formed of Cu-TiC alloy and a bonding layer is a Ag-Cu-Mn based bonding layer formed of Ag (all or part of Ag substituted by Cu) and Mn (all or part of Mn substituted by one of Ti, Zr and Cr).