发明名称 COMPONENT CONNECTING EQUIPMENT OF HIGH-DENSITY BOARD
摘要 PROBLEM TO BE SOLVED: To provide component connecting equipment of a high-density board wherein an installation member is connected at high precision for stable production. SOLUTION: There are provided a high-density board 3 which comprises first position mark pairs 23a and 23b related to first conductive terminals 21, an installation member 4 which comprises second position mark pairs 25a and 25b corresponding to second conductive terminals 24, a calculating unit which calculates first and second theoretical reference points corresponding to the coordinate position of each position mark pair based on the image signal of first and second position mark pairs, two axles positioning apparatuses 9 and 11 where the first and second theoretical reference points are agreed with each other for polymerizing-driving, and a heating/melting means wherein, with the first and second theoretical reference points agreed with each other, a solder material applied to at least either of the first and second conductive terminals is heated and melted for bonding.
申请公布号 JP2001244694(A) 申请公布日期 2001.09.07
申请号 JP20000053455 申请日期 2000.02.29
申请人 MITSUBISHI ELECTRIC ENGINEERING CO LTD 发明人 KAMIYOSHI SATOSHI;NAGASASHI AKIZOU
分类号 H05K13/04;H05K1/02;H05K3/36 主分类号 H05K13/04
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