| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring structure, by which the laminating film forming of alloy 2 essentially of silver (Ag), or silver (Ag), and other metallic materials is performed, and a wiring pattern is formed through one-time photolithography. SOLUTION: The device is equipped with a plurality of first parallel wirings formed on the substrate 1, a plurality of second parallel wirings intersecting the first parallel wirings, and a plurality of active elements, which are set near each intersection point of the first parallel wiring and the second parallel wiring and are connected to the corresponding first parallel wiring and second parallel wiring. Each a part or all of the first parallel wiring and the second parallel wiring has the laminated structure with the alloy 2, essentially consisting of silver (Ag) or silver (Ag) and the metal with the normal electrode potential of a dissolution reaction lower than silver (Ag), or the alloy 3, consisting essentially of that metal, and is formed through one-time photolithography.</p> |
