发明名称 HIGH EFFICIENT DEVICE COOLING SYSTEM AND COOLING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an energy saving type high efficient device cooling system and a cooling method in which the cooling system is made compact in size. SOLUTION: Each of a plurality of cooled items 111a, 111b and 111c is divided into groups 102, 103 and 104 for every cooling temperature regions. There is provided each of independent primary cooling water supplying pipes 110a, 110b and 110c for every group. Each of the primary cooling water supplying pipes is provided with heat exchangers 108a, 108b, 108c. A secondary cooling water supplying pipe 107 separate from the primary cooling water supplying pipe is arranged to pass in sequence through each of heat exchangers in an order of low temperature in the cooling temperature region.
申请公布号 JP2001241818(A) 申请公布日期 2001.09.07
申请号 JP20000049933 申请日期 2000.02.25
申请人 OMI TADAHIRO;HITACHI PLANT ENG & CONSTR CO LTD;KUMAGAI GUMI CO LTD;TAISEI CORP;TAKASAGO THERMAL ENG CO LTD 发明人 OMI TADAHIRO;HIRAYAMA MASAKI;SHIRAI YASUYUKI;HANAOKA HIDEO;SUZUKI HIROKAZU;YAMAZAKI YOSHIO;OKUBO YOSHINORI
分类号 F25D17/02;C02F1/20;C02F5/08;F25D9/00;(IPC1-7):F25D9/00 主分类号 F25D17/02
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