| 摘要 |
PROBLEM TO BE SOLVED: To downsize the substrate and the entire device by enabling overlap of electric circuits such as signal processing circuit and the like and optical devices such as laser diode and the like. SOLUTION: With respect to the optical device which is formed by integrating optical devices such as a light-emitting device 3, a photodetector 5 and the like and electrical circuits 6 such as a signal processing circuit and the like on one substrate 2, a protective member 8 exhibiting insulating property, shading property, specified deformation strength and the like is formed on the electric circuits 6 and the optical device 3 is overlapped onto the protective member 8. By interposing the protective member 3 between the optical device 3 and the electric circuits 6, the effect of distortion and heat is reduced. |
