发明名称 Laminated smart card arrangement e.g. for telephone card
摘要 A smart card has a card body of at least a first layer (1) and a second layer (2) joined to the first layer, both layers being made from paper or film/sheeting/foil, a semiconductor chip (6) arranged in the first layer (1) and comprising an integrated circuit and at least one contact. At least one terminal (contact) (3) is provided and an electrically conductive connection (7) is provided between the terminal (contact) (3) and the chip contact. The semiconductor chip (6) is arranged in the first layer in such a way that the chip contact faces the second layer and the terminal (contact) (3) is arranged opposite the chip contact on the second layer. At least one pad (4) is specifically provided on the side of the second layer (2) facing away from the first layer (1), and between the terminal (contact) (3) and the pad (4) is provided an electrically conductive connection (5) piercing the second layer (2).
申请公布号 DE10016715(C1) 申请公布日期 2001.09.06
申请号 DE2000116715 申请日期 2000.04.04
申请人 INFINEON TECHNOLOGIES AG 发明人 PUESCHNER, FRANK;HEINEMANN, ERIK
分类号 B42D15/10;B42D117/00;G06K19/077;(IPC1-7):G06K19/077;B32B33/00;B32B29/00 主分类号 B42D15/10
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