| 摘要 |
The manufacturing method has adhesive impregnated intermediate layers (4) inserted between metal foil outer layers (2a,2b) and at least one inner layer (3), for bonding the layer structure (1) together upon application of heat and pressure. A number of layer structures can be stacked together with separation layers (5) between them for simultaneous compression, the top foil outer layer (2a) of an underlying layer structure and the bottom foil outer layer (2b) of an overlying layer structure provided by a U-shaped foil, wrapped around the opposing surfaces of a separation layer under clean conditions, before insertion of the latter in the stacked layer structure. An Independent claim for a multi-layer printed circuit board manufacturing device is also included. |
