发明名称 |
Semiconductor device and fabrication method thereof |
摘要 |
To provide a semiconductor device having high mass production performance and high reliability and reproducibility by simple fabrication steps, in a constitution of a semiconductor device of a bottom gate type formed by a semiconductor layer having a crystal structure, source and drain regions are constituted by a laminated layer structure comprising a first conductive layer (n+ layer), a second conductive layer (n- layer) having resistance higher than the first conductive layer and an intrinsic or a substantially intrinsic semiconductor layer (i layer) in which the n- layer functions as an LDD region and the i layer functions as an offset region in a film thickness direction.
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申请公布号 |
US2001019859(A1) |
申请公布日期 |
2001.09.06 |
申请号 |
US20010824703 |
申请日期 |
2001.04.04 |
申请人 |
YAMAZAKI SHUNPEI;KOYAMA JUN;SATOU YURIKA |
发明人 |
YAMAZAKI SHUNPEI;KOYAMA JUN;SATOU YURIKA |
分类号 |
H01L21/328;G02F1/1362;H01L21/20;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L27/13;H01L29/786;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/328 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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