发明名称 |
Method of interconnecting electronic components using a plurality of conductive studs |
摘要 |
A method of interconnecting electronic components by using a plurality of conductive studs on a surface of a first electronic component and a plurality of corresponding conductive vias on the surface of a second electronic component. Camber on the surface of electronic components may be overcome by coating the surface with a dielectric, planarizing the dielectric, and forming conductive vias corresponding to the contact pads thereon. The conductive studs are substantially lead-free and preferably comprise of copper.
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申请公布号 |
US2001019178(A1) |
申请公布日期 |
2001.09.06 |
申请号 |
US20010825512 |
申请日期 |
2001.04.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BROFMAN PETER J.;RAY SUDIPTA K.;STALTER KATHLEEN A. |
分类号 |
H01L21/60;H01L23/498;H05K3/32;(IPC1-7):H01L29/40;H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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