发明名称 |
Injection molding apparatus and a method therefor |
摘要 |
There is provided an infection molding apparatus capable of preventing an occurrence of over-packing which is comprised of: a pair of dies for forming a plurality of cavities therebetween; die closing devices for closing the pair of dies under a prescribed pressure; an injection device for Injecting a molten resin into respective cavities under a prescribed pressure; and a control device for controlling the die closing devices and the Injection device, and further the apparatus comprises a plurality of pressure sensors for detecting respective pressures in respective cavities, wherein the control device controls the injection device and/or the die closing devices to reduce a rate of injection of the molten resin and/or a force of closing of the dies, otherwise to stop the injection and/or the die closing operation when a pressure difference between cavities is found to be greater than a prescribed value on the basis of sensed values from the respective pressure sensors.
|
申请公布号 |
US2001019183(A1) |
申请公布日期 |
2001.09.06 |
申请号 |
US20010778805 |
申请日期 |
2001.02.08 |
申请人 |
KISHI SHINSUKE;YOSHIMURA HIDEAKI |
发明人 |
KISHI SHINSUKE;YOSHIMURA HIDEAKI |
分类号 |
B29C45/64;B29C45/00;B29C45/46;B29C45/76;B29C45/77;(IPC1-7):B29C45/76 |
主分类号 |
B29C45/64 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|