发明名称 Apparatus and method for processing micro-v grooves
摘要 <p>A voltage is applied between a cylindrical cutting grindstone 2 that rotates about a vertical axis Y and a cylindrical truing grindstone 6 that rotates about a horizontal axis X. The vertical outer surface 2a and the horizontal lower surface 2b of the cutting grindstone are trued by a plasma discharge. Then without applying the voltage, the cutting grindstone 2 is trued mechanically by the truing grindstone 6, and while the outer periphery and lower surface of the cutting grindstone are dressed electrolytically, the outer periphery and lower surface are made to contact a workpiece 1 and process a micro-V groove. This method makes it possible to produce an immersion grating with a high resolution using hard, brittle materials such as germanium, gallium arsenide and lithium niobate. &lt;IMAGE&gt;</p>
申请公布号 EP1129817(A2) 申请公布日期 2001.09.05
申请号 EP20010105031 申请日期 2001.03.01
申请人 RIKEN;THE NEXSYS CORPORATION 发明人 OHMORI, HITOSHI;EBIZUKA, NOBORU;YAMAGATA, YUTAKA;MORITA, SHINYA;MORIYASU, SEI;ASAMI, MUNEAKI
分类号 B23H5/00;B23H5/04;B24B13/01;B24B13/015;B24B19/02;B24B53/00;(IPC1-7):B24B19/02;B23H5/08 主分类号 B23H5/00
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