| 发明名称 |
Multi-layer plated lead frame |
| 摘要 |
A multi-layer plated lead frame is provided. The lead frame has a structure in which a first precious metal plating layer, an intermediate plating layer, and a second precious metal plating layer are sequentially formed on a substrate made of ferroalloy. The lead frame shows improvement in all properties including wire bonding, anti-corrosion, and solderability. |
| 申请公布号 |
GB2322475(B) |
申请公布日期 |
2001.09.05 |
| 申请号 |
GB19980003365 |
申请日期 |
1998.02.17 |
| 申请人 |
* SAMSUNG AEROSPACE INDUSTRIES, LTD. |
发明人 |
JOONG-DO * KIM;YOUNG-HO * BAEK;KYUNG-SOON * BOK |
| 分类号 |
C25D5/26;C23C28/02;C25D7/00;H01L21/50;H01L21/60;H01L23/48;H01L23/495;H01L23/50 |
主分类号 |
C25D5/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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