| 摘要 |
<p>A TRIAC which is one species of chip-type semiconductors includes an element body (10) made of silicon, electrodes (11, 12) provided on one face of the element body (10), a molybdenum plate (30) provided on the electrode (12) by an alloy plate (1) made of aluminum and silicon, a molybdenum plate (31) provided on the other face of the element body (10) by a similar alloy plate (2), and nickel layers (3, 4) provided on connection faces of the molybdenum plates (30, 31) to outer electrode plates (40, 41), so that the electrode (12) and molybdenum plate (30) are firmly connected without conventional high-temperature solder which includes a great amount of lead, and that the alloy plate (1) never melt even when newly developed low-temperature institute is employed, and that the operation of the molybdenum plates (30, 31) is sufficiently realized. <IMAGE></p> |
