发明名称 |
Semiconductor device and substrate for semiconductor device |
摘要 |
In a substrate for a semiconductor device including a plurality of first through holes and a wiring pattern having a conductive land portion covering the entire surface of the opening of each of the first through holes on one surface, a second through hole is formed in a region other than the forming region of the wiring pattern, and the shape of opening of said second through hole is not a circular shape and has a corner portion.
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申请公布号 |
US6285086(B1) |
申请公布日期 |
2001.09.04 |
申请号 |
US20000559253 |
申请日期 |
2000.04.27 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
SOTA YOSHIKI;JUSO HIROYUKI |
分类号 |
H01L23/12;H01L21/56;H01L23/13;H01L23/31;H05K1/02;H05K3/34;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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