| 摘要 |
PROBLEM TO BE SOLVED: To facilitate an operation to set parameters for forming a coating film which shows a high yield of a coating liquid and also high uniformity, and further, for obtaining a required film thickness, when a resist film, or the like, is formed on a substrate, for example. SOLUTION: A resist liquid is applied, in a fine diameter linear shape, to the surface of the substrate from a coating liquid nozzle 2, while the substrate is scanned in the X direction by moving the coating liquid nozzle. Next, the resist liquid is likewise applied to the substrate by moving the substrate at a specified pitch to the coating liquid nozzle in the Y direction. That is, the application is made, so to speak, in such a way that a picture is drawn with a single stroke of the brush. In addition, the relationship between the discharge pressure and the discharge flow rate of the coating liquid is stored in memory per the amount of a solid matter in the resist liquid, and a parameter setting part is formed which seeks the remaining one parameter by designating the two parameters out of parameters such as the scan velocity of the coating liquid nozzle 2, the pitch which is a movement of the substrate in the Y direction and the discharge pressure of the coating liquid by using the stored relationship. Further, the parameter setting part has a function to revise a parameter value based on a measured film thickness. |
