发明名称 METHOD FOR MANUFACTURING CAPACITOR USING SELECTIVE HEMISPHERICAL GRAIN GROWTH BY POLYMER ADHESION AND CAPACITOR MANUFACTURED THEREBY
摘要 PURPOSE: A capacitor manufactured by using a selective hemispherical grain growth is provided to effectively prevent a bridge phenomenon while maintaining the same electrical characteristic as compared with a conventional hemispherical grain(HSG) capacitor, by making the HSG not formed in the upper surface and the corner of a lower electrode of a cylinder type. CONSTITUTION: A hemispherical grain(HSG) is formed on the outer, inner or outer/inner surfaces of a lower electrode(142) of a cylinder shape, and the spherical grain is formed only on the surface except the upper surface and the corner of the lower electrode of the cylinder shape. A dielectric layer is formed on the lower electrode. An upper electrode is formed on the dielectric layer.
申请公布号 KR20010083563(A) 申请公布日期 2001.09.01
申请号 KR20000007308 申请日期 2000.02.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, GI HYEON;KIM, DONG HYEON
分类号 H01L21/302;H01L21/02;H01L21/205;H01L21/3065;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L21/302
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