发明名称 |
METHOD FOR MANUFACTURING CAPACITOR USING SELECTIVE HEMISPHERICAL GRAIN GROWTH BY POLYMER ADHESION AND CAPACITOR MANUFACTURED THEREBY |
摘要 |
PURPOSE: A capacitor manufactured by using a selective hemispherical grain growth is provided to effectively prevent a bridge phenomenon while maintaining the same electrical characteristic as compared with a conventional hemispherical grain(HSG) capacitor, by making the HSG not formed in the upper surface and the corner of a lower electrode of a cylinder type. CONSTITUTION: A hemispherical grain(HSG) is formed on the outer, inner or outer/inner surfaces of a lower electrode(142) of a cylinder shape, and the spherical grain is formed only on the surface except the upper surface and the corner of the lower electrode of the cylinder shape. A dielectric layer is formed on the lower electrode. An upper electrode is formed on the dielectric layer.
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申请公布号 |
KR20010083563(A) |
申请公布日期 |
2001.09.01 |
申请号 |
KR20000007308 |
申请日期 |
2000.02.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, GI HYEON;KIM, DONG HYEON |
分类号 |
H01L21/302;H01L21/02;H01L21/205;H01L21/3065;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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