| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of mounting a work with which the generation of air bubbles in an underfill resin can be prevented, and a mounted body of the work. SOLUTION: A substrate 1 on which a flip chip 11 is loaded via bumps is housed in a casing 34 of a plasma processing apparatus 30, and a plasma- generating gas is supplied to the inside of the casing 34 with pressure ranging 200 [pa]-800 [pa] to generate plasma discharge. A material activated by the plasma discharge generated under the aforementioned pressure condition penetrates efficiently into the gap between the substrate 1 and the flip chip 11, and enhances wettability by favorably modifying the surface of the resist on the substrate 1 and of the passivation film of the flip chip 11 by the action of the activated material. As a result, in filling an underfill resin into the gap, the underfill resin is favorably adhered to the modified surfaces, and favorable filling can be made without generating air bubbles.</p> |
