| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and a semiconductor device in which even semiconductor chips having lowered strength can be bonded surely to each other. SOLUTION: Surface of a first semiconductor chip 22 is mirror finished and a first connection terminal 26 projecting therefrom is made flush with that surface. A second semiconductor chip 24 is then lowered similarly to the first semiconductor chip 22 and mirror finished surfaces are vacuum compressed each other. Since the semiconductor chips are vacuum compressed, the mirror finished connection terminals can be bonded to conduct electrically by simply pasting the surfaces of the first and second semiconductor chips 22, 24. Since the parts other than the connection terminals are also mirror finished, these parts can be bonded each other. Consequently, the first and second semiconductor chips 22, 24 can be bonded without relying upon heating, pressurization or an anisotropic conductive adhesive. |
