| 摘要 |
PROBLEM TO BE SOLVED: To obtain uniform film thickness distribution over a long period in a multi-cathode-type sputtering system. SOLUTION: In this sputtering method, film deposition is applied to the surface of a substrate 3 by using a plurality of targets 6 in vacuum. Moreover, electric power to be applied to each of the targets 6 is nearly equalized, and the distance between the target 6 and the substrate 3 is set independently for each target 6. The ratio of the electric power applied to each of the targets 6 to the minimum applied electric power is regulated to <=1.5.
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