发明名称 CHIP LED MOUNTED PRINTED CIRCUIT BOARD STRUCTURE AND MOUNTING METHOD
摘要 PURPOSE: A chip LED mounted printed circuit board(PCB) structure and mounting method are provided to shorten the manufacturing time by allowing the chip LED to mount on a surface where general components are mounted and to reduce the cost by excluding the peel coating. CONSTITUTION: The chip LED mounted PCB(1) comprises a plurality of holes(2), a plurality of chip LEDs(5), and general components(4). Each hole is formed on the LED mounted position to emit the light of each LED. All LEDs and general components are mounted on one surface of the PCB. The diameter of each hole is those of diode. The light of LED is emitted through the hole, which allows the recognition of light under the PCB. The mounting method includes the steps of penetrating the PCB to form the holes, mounting the general components on one surface of PCB, and mounting the LEDs on the same surface.
申请公布号 KR20010082793(A) 申请公布日期 2001.08.31
申请号 KR20000008112 申请日期 2000.02.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, GI HYEON
分类号 H05K3/30;(IPC1-7):H05K3/30 主分类号 H05K3/30
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