ELECTROPLATING JIG

摘要

PROBLEM TO BE SOLVED: To provide an electroplating jig with which the thickness of an electroplating layer is kept almost uniform. SOLUTION: A substrate 1 is held in a plating bath 2 and electroplated by this electroplating jig A. The jig is provided with a frame 3 for holding the substrate 1 and applying a current to the substrate 1 and a current applying auxiliary bypass 4 for electrically connecting plural parts of the frame 3. The current density is practically uniformized between an electroless plating layer and a circuit which are positioned at a part of the substrate 1 near a power source and an electroless plating layer and a circuit which are situated at a part far from the power source.