| 发明名称 |
Bump-forming method using two plates and electronic device |
| 摘要 |
First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.
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| 申请公布号 |
US2001018263(A1) |
申请公布日期 |
2001.08.30 |
| 申请号 |
US20000749521 |
申请日期 |
2000.12.28 |
| 申请人 |
OCHIAI MASAYUKI;UEDA HIDEFUMI;SONO MICHIO;YAMAGUCHI ICHIRO;MITOBE KAZUHIKO;OTAKE KOKI;KASAI JUNICHI;KAMEHARA NOBUO;YAMAGISHI YASUO;MIZUKOSHI MASATAKA |
发明人 |
OCHIAI MASAYUKI;UEDA HIDEFUMI;SONO MICHIO;YAMAGUCHI ICHIRO;MITOBE KAZUHIKO;OTAKE KOKI;KASAI JUNICHI;KAMEHARA NOBUO;YAMAGISHI YASUO;MIZUKOSHI MASATAKA |
| 分类号 |
B23K3/06;H01L21/48;H01L21/60;H01L21/68;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
B23K3/06 |
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