Manufacturing electronic semiconducting components involves attaching semiconducting body to conductive substrate, making electrical connections, encapsulating body, dividing substrate

摘要

The method involves providing a conductive substrate (1), attaching a semiconducting body (2) to a first surface side of the substrate, making electrical connections (3.1,3.2) from the body to the first surface side, making a housing body (4) by encapsulating the semiconducting body and connections with insulating material and making mutually electrically insulated connection surfaces (5.1,5.2) by dividing the substrate from a second side. Independent claims are also included for the following: the use of the method for manufacturing light emitting semiconducting components and the use of the method for manufacturing active and passive semiconducting components.