METHOD AND APPARATUS FOR POLISHING OUTER PERIPHERAL CHAMFERED PART OF WAFER

摘要

In a polishing method for mirror finishing the peripheral chamfered part of a wafer using an abrasive cloth while supplying abrasive to the peripheral chamfered part in order to enhance the productivity of the polishing process by shortening the polishing time, a plurality of steps including at least two polishing steps are carried out sequentially. The polishing method comprises a first polishing step for polishing the part corresponding to the {110}face of the peripheral chamfered part of a wafer, and a second polishing step for polishing the peripheral chamfered part of the wafer entirely. An abrasive cloth used in the second polishing step has a hardness lower than that of an abrasive cloth used in the first polishing step, and the abrasive used in the second polishing step has a grain size smaller than that of the abrasive used in the first polishing step. Polishing speed is varied by varying the hardness of the abrasive cloth and/or the grain size of the abrasive.