| 摘要 |
PURPOSE: To provide a semiconductor chip manufacturing capable of manufacturing a very thin semiconductor chip, without causing breaks or chipping. CONSTITUTION: The method comprises grinding the backside of a wafer having many chips formed on the surface to form a wafer of a specified thickness, polishing or etching the backside of the wafer to remove crushed layers formed in the backside grinding, forming trenches of a specified thickness into the backside of the wafer along streets formed between the chips, and scribing the wafer along the trenches to divide it into individual chips. Thus, the crushed layers are removed from the backside of the wafer after grinding the backside and the wafer is divided in the individual chips by utilizing the cleavage, thereby effectively suppressing the cracks or breaks from occurring.
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